Engineering the Future of Satellite Communications: Insights from SATSHOW 2026
SATSHOW has long been a barometer for where satellite communication is heading. This year’s conference was held in Washington, DC and it continues to serve as a valuable checkpoint for the satellite communications industry. This year the shift toward higher frequency bands was front and centre, but so too were the challenges that come with it. Farran’s CEO, Tomasz Waliwander, observed a gap that is beginning to emerge between what the industry says it is delivering and what it is technically prepared to execute. This is not a gradual evolution. It’s a shift that is already reshaping how RF systems are designed, where the bottlenecks sit, and what it takes to compete. The Constraint Has Moved For years, spectrum availability was seen as the primary limiter in satellite communications. That assumption no longer holds. As systems push beyond Ka-band into Q/V-band and E-band, bandwidth is no longer the constraint. RF performance is. These higher frequency bands unlock massive capacity, but they come with trade-offs that cannot be ignored: increased atmospheric attenuation, tighter link margins, and a dependence on beamforming to maintain reliability. In practical terms, this means the complexity of system design has increased significantly. It is clear that the real limitation in capacity now stems from RF, rather than from spectrum. Power Amplification Under Pressure At the hardware level, the most immediate bottleneck is power. Delivering efficient, linear power at these frequencies is becoming increasingly difficult. Technologies such as Gallium Nitride (GaN) and Indium Phosphide (InP) are being pushed harder than ever, with engineers forced to balance output power, efficiency, linearity, and thermal constraints simultaneously. There are no clean trade-offs anymore. Improving one parameter almost always impacts another. This is where real expertise shows. The ability to manage these competing demands at a system level and not just at a component level is quickly becoming a defining capability in the industry. Packaging Is Now Performance Another clear takeaway from SATSHOW is that packaging can no longer be treated as a secondary concern. At frequencies between 50 and 90 GHz, even minor losses between MMICs and waveguide interfaces can significantly degrade system efficiency. What was once considered a detail is now central to performance. As a result, the industry is moving toward tightly integrated solutions such as antenna-in-package and wafer-level designs. These approaches reduce loss, improve efficiency, and support the kind of performance required at mmWave frequencies. Effective RF design is defined by how all components work together, rather than by the capabilities of any single element. Scaling Changes Everything The rise of electronically steerable arrays is also changing the nature of the challenge. Instead of building a single high-power RF chain, the focus is shifting toward scaling thousands of smaller, lower-power elements. This introduces a completely different set of requirements: cost, repeatability, thermal management, and manufacturability all come to the forefront. This highlights a problem in the system rather a component problem. Success depends on how well antenna design, RF performance, and digital control are integrated. The Emergence of RF Tiles What is emerging as a result is a new architectural approach: modular, highly integrated RF “tiles.” These tiles combine amplification, beamforming, and control into scalable building blocks that can be replicated across large arrays. They are designed with the full system in mind, not as standalone components. This shift has significant implications for the competitive landscape. The advantage will no longer go to those who simply deliver the highest-performing individual parts. It will go to those who can integrate those parts into scalable, manufacturable systems that perform reliably in real-world conditions. A Leadership Perspective on the future Satellite Communication These insight from Farran’s CEO reflects a clear understanding of where the industry is heading. Satcom RF is moving away from bespoke, one-off high-performance hardware and toward scalable, production-driven systems. That transition requires a mindset that combines deep technical expertise with a practical understanding of how systems are built, deployed, and scaled. There is no ambiguity here. The companies that succeed will be those that can execute across the full stack—from RF physics to system integration to manufacturing. This is the space Farran is focused on. Not just keeping up with the shift, but leading within it. Connect with us to learn how Farran’s expertise in RF integration and system-level design is helping operators and manufacturers stay ahead in a rapidly evolving satellite communications landscape.







